Tsmc 16ffc Vs 12ffc

9GB/s peak BW) • 13. From this 5-day-old article from Anandtech, TSMC only has 12nm FFC which is a pseudo-half node from 16FFC. Now, TSMC has said it will introduce a 16FFC variant of its 16FF+ process. Please login Quick Navigation Analog Integrated Circuit (IC) Design, Layout and Fabrication Top. ) optimized to meet even the most demanding requirements for high performance, high density and low power. eFPGA IP cores for TSMC 12FFC/FFC+/16FF+/FFC/FFC+ The EFLX4K Logic IP core is an eFPGA IP core contains 4K LUT4, 21Kb of Distributed Memory and has 632 input pins and 632 output pins. ) which is specified under the Mx section in the DRM. The standard cell library typically contains both logical and physical representations for use with standard place and route tools. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC's N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers' SoC timing and clock demands. ANSYS recognized for leading-edge power and reliability analysis solutions. TSMC’s advanced packaging solutions enable system integration with wafer level process, by seamless integration of front end wafer process and backend chip packaging. 당시에 논란을 언급하면서 간단히 공정 성능을 비교했었는데, (링크 : 애플 A9 논란에 관하여. 5x the native logic density of the other processes at this same node. GTX 980 Ti vs. TSMC's 16nm FinFET processes consisting of 16FF (16nm FinFET), 16FF+ (16nm FinFET Plus) and 16FFC (16nm FinFET Compact) will account for more than 20% of the foundry's total wafer revenues in 2016. 5-track, High Performance & High Density (with or without CPODE, 90nm or 96nm poly pitch). • Providing leadership for 7nm NPI activities for AMD’s SCBU products; Responsible for Si characterization, product bounding box based on charz, yield; development of test APIs/algorithms for 16FFC/12FFC products working with IP designers to achieve maximum coverage within overall estimated test cost in production across SORT/FT/SLT. ANSYS Wins Three TSMC Partner of the Year Awards. High performance, consumer cost, and with already a couple of years of volume manufacturing experience. (Simultaneously, TSMC is also dropping the VDD_min on their flagship 16FFC node to 0. TSMC introduces 12nm half-node. Samsung's second-generation 10nm node, 10nm LPP, is now ready for mass production, with further performance and power consumption improvements over its older technology, 10nm LPE. 2 東芝レビューVol. As for TSMC, its 10 nm process technology (CLN10FF) is now qualified for production at the company’s GigaFabs 12 and 15, where high-volume ramp is expected to start in H2 2017. 0 PHY in TSMC 16FFC : PCIe 3. 3GHz for the Kirin 950’s A72 cores. 5K will be available in early 2017 for TSMC 16FF+/FFC. 1/DisplayPort 1. Silicon Creations has collaborated with TSMC, the world’s leading foundry,. Tsmc Library Download. LAWRENCEVILLE, GA –– October 2, 2018 –– Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC’s 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer’s SoC timing demands. FlexLogix validates eFPGA cores on TSMC 16nm The EFLX4K eFPGA FlexLogix IP core, both the Logic and DSP versions, have been fully validated on TSMC16FFC. eFPGA IP cores for TSMC 12FFC/FFC+/16FF+/FFC/FFC+ The EFLX4K Logic IP core is an eFPGA IP core contains 4K LUT4, 21Kb of Distributed Memory and has 632 input pins and 632 output pins. EDA365定位于做中国最专业的电子工程师技术网站,覆盖了手机数码,通信硬件,新能源汽车,电子技术,半导体芯片,计算机硬件,人工智能,消费电子等各大领域,版主们大多来自华为、中兴、思科、Intel等世界500强公司,拥有丰富的通信产品设计、计算机与服务器设计、安防产品设计、医疗产品. This process maximizes die cost scaling by simultaneously incorporating optical shrink and process simplification. "This initial set of protocols demonstrates the versatility of this IP, which we ported to TSMC's 12FFC and 16FFC processes from the PMA we built for Microchip Technology's PolarFire FPGA. Compared with 16FFC, 16FFC+ has improved 10% same-power speed or 20% same-speed power. Even though the eFPGA delivered is in 180nm, it uses the exact same digital architecture (Gen2 EFLX4K) implemented on TSMC28HPC/HPC+, TSMC16FF+/16FFC/12FFC and is now in design for GlobalFoundries 14LPP. EFLX-100 in TSMC 16FF+/FFC enables programmable networking chips with wide, reconfigurable logic from 100 to 2500 LUTs running about 1GHz (exact speed depends on the RTL and the voltage range). EFLX-100 is available now for TSMC 16FF+/FFC. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. This means Sandia can use the same EFLX Compiler, with GUI Interface, that all of Flex Logix’ other customers use. TSMC also certified a suite of the company's digital, custom and signoff tools for the 16FFC process. We expect shortly to see customers using it for PCIe4 and 10G-KR as well. And ANSYS is collaborating with TSMC on a suite of solutions for fan-out technology, including multi-die analysis for extraction, power, reliability, signal and power integrity, and thermal and electromagnetic interference. Another major company adopts EFLX eFPGA. The Cortex-A75 POP IP for TSMC 16FFC offers the fastest performance in one of the most cost-effective process technologies available. , June 9, 2020 Place: TSMC’s Headquarters (No. 0 at 8GT/s : x1. Cadence Recognized with Three TSMC Partner of the Year Awards: Cadence Design Systems, Inc. TSMC had finished developing 16-nano FFC process in 4th quarter of last. 12LP was. ICs fabricated in the 16FFC process may be used in ultra-low-power applications such as wearables and IoT. 16FFC / 12FFC 技术. MIPI C-PHY v1. , June 9, 2020 Place: TSMC’s Headquarters (No. Moreover, we had completed the characterization in TSMC's 7nm FinFET process in September, 2017 to keep NeoFuse development in leading-edge process nodes at the early stage. ARM announced a platform of dedicated automotive ARM Artisan physical IP for TSMC 16FFC. Cadence Design Systems, Inc. FlexLogix validates eFPGA cores on TSMC 16nm The EFLX4K eFPGA FlexLogix IP core, both the Logic and DSP versions, have been fully validated on TSMC16FFC. Dolphin Technology has assembled a core team of experienced Standard Cell design veterans that have created an extensive offering of highly optimized Standard Cell libraries. TSMC provides foundry's most advanced and comprehensive portfolio of Mixed Signal/RF CMOS (MS/RF) technology. L'appellation commerciale exacte n'a pas été donnée, et on ne sait pas exactement quand elle sera disponible. [48] [49] MediaTek said Sports Mode is designed to show full capabilities during benchmarks , that its standard practice in the industry, and their device makers can. 16FFC is a “compact” version of TSMC’s 16FF+ process. jp 16/12nm Technology – Taiwan Semiconductor Manufacturing Company Limited TSMC Symposium: New 16FFC and 28HPC+ Processes Target “Mainstream” Designers and Internet of Things (IoT) – Industry Insights – Cadence Blogs – Cadence Community. Also, there is an optical shrink of 16FFC called 12FFC. ハイパフォーマンス向けの16FF+を低コストにしたのが16FFC (16FF Compact) であり、メインストリーム向けや低消費電力 (Ultra Low Power) 向けに位置付けされている。 参考: * 10nmに見切りをつけ低コストの12FFCに注力 TSMC 半導体ロードマップ - ASCII. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC’s N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers’ SoC timing and clock demands. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property , announced a variety of new IP offerings on TSMC's N5, N5P, N7, N7+, 12FFC, and 22ULP. Notably, the company has a mixed record of earnings surprises in the trailing four quarters, with an average. 台积电(tsmc)28hpc ssg工艺角和28hpm ss 工艺角. TSMC’s new 12nm 12FFC process node was the first to be found in the Taiwanese mobile chip manufacturer, MediaTek's processors, in competition to other processor manufacturers. TSMC and its customers jointly unleash a number of innovations in the MS/RF segment and account for a 75% share of this market. For one, there are at least three different 16nm's that TSMC has, and the one that ARM uses could be clocking higher than SS/GF's 14nm too. The 16FFC process which has had eight design wins is not yet in volume production. TSMC had finished developing 16-nano FFC process in 4th quarter of last. 16FFC RF led the foundry to start volume production of the fifth generation (5G) mobile network. • Short lived half node for TSMC. This unique IP is used for sending source clocks to SERDES for PCIe, SATA, SAS and HMC applications. Re: What does metal stack option 8m5x2y2z mean ? 5x means not just width but metals M2,M3,M4,M5,M6 have the design rules of Mx (spacing, area, etc. We are not certain what the addition of the ‘W’ in the new number signifies. Evaluation boards are available now that integrate the EFLX200K validation chip (a 7×7 array of EFLX 4K cores: 182K LUT4, 560 MACs, 1. Our newest addition to the N16/N12 families are the 16FFC+ and 12FFC+. TSMC co-CEO CC Wei remarked at the company’s most recent investors meeting that TSMC ‘s share of the 14/16nm foundry market segment will rise above 70% in 2016 from around 40% in 2015. Wang, who oversees TSMC's fab operations. Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process Sep 7, 2017 Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform. 5K will be available in early 2017 for TSMC 16FF+/FFC. The company is also moving its higher capacity EFLX-2. Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC Linus Tech Tips Quote Quote Samsung and TSMC made several important announcements about the present and future of their semiconduct. Il s'agit de la quatrième version du 16nm de TSMC après le 16FF, le 16FF+, et le 16FFC, un process qui avait été vaguement évoqué en janvier dernier. Site Areas; Settings; Private Messages. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. Variety of PLLs supported in multiple TSMC process nodes. 3 which makes a huge difference with a lot of benchmarks). Eddie Staley Thu, 02 Mar 2017 17:06:08 -0400 Option Alert: Mentor Graphics Apr $35 Call; 7455 @Bid @$2. ICs fabricated in the 16FFC process may be used in ultra-low-power applications such as wearables and IoT. May 31, 2017: Higher performance, higher density Gen 2 architecture EFLX-2. Please login Quick Navigation Analog Integrated Circuit (IC) Design, Layout and Fabrication Top. Disclaimers: GuruFocus. 1, SATA 6G, HDMI 2. 台积电宣布其7纳米制程进入量产 并透露了5纳米节点的首个时间表-持续同时朝多面向快速进展的晶圆代工大厂台积电(tsmc),于美国硅谷举行的年度技术研讨会上宣布其7纳米制程进入量产,并将有一个采用极紫外光微影(euv)的版本于明年初量产;此物该公司也透露了5纳米节点的首个时间表. Quote Intel is encountering tight 14nm process production capacity in-house, and is looking to outsource part of its 14nm chip production to Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources. TSMC MS/RF technology supports multiple communication applications, including smartphones, wireless, Bluetooth, and others. Even though the eFPGA delivered is in 180nm, it uses the exact same digital architecture (Gen2 EFLX4K) implemented on TSMC28HPC/HPC+, TSMC16FF+/16FFC/12FFC and is now in design for GlobalFoundries 14LPP. 16FFC RF led the foundry to start volume production of the fifth generation (5G) mobile network. However, there is also a new 6T standard cell library, that pushes density up 1. This process maximizes die cost scaling by simultaneously incorporating optical shrink and process simplification. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan) (If a change in meeting venue is warranted due to COVID-19 epidemic. Dolphin provides a wide range of Memory Compilers and Specialty Memory (ROM, Multi-Port RF, CAM, etc. Both 16FFC and 12FFC have shown strong adoption data with over 220 tapeouts. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. To recap, AI and 5G are key drivers for both mobile and HPC product evolutions. The design is silicon-proven on TSMC’s industry leading 16nm FinFET Compact Technology (16FFC). 0 & Multi-Protocol 16G PHY in TSMC 12FFC. 1/DisplayPort 1. 28HPC, 28HPC+,16FFC, 12FFC, 7FFC for mainstream smartphone and automotive 50ULP,28HPC+, 28ULP, 22ULP, 12FFC/ULP for low power applications and IoT Sieht wie du sagst eher höchstens nach Xavier in 12nm aus, aber eine Sache versteh ich nicht:. TSMC has started mass production of their 7nm process node and NVIDIA seems to be a major customer including AMD, Apple, Qualcomm, Bitmain. 来源:内容由公众号半导体行业观察(ID:icbank)原创,谢谢! 台积电在半导体行业的地位毋庸置疑。但他们究竟有多强大,大部分读者了解得可能非常片面。. 今天我们只聊PPT,不谈技术~近日,ARM发布了新一代CPU微架构Cortex-A76和新一代GPU微架构Mali-G76。ARM作为移动计算领域最大的指令集和架构授权厂商,在当前正热门的智能终端领域有着举足轻重的地位。. We estimate that the Intel 14nm process provides >1. Moving from TSMC 28nm to TSMC 16nm FinFET can be done easily: 9 track or10. 67X的能耗比(节约40%的功耗)。官网介绍说7nm将会有一个移动处理器的节点以及一个高性能的优化节点。. May 31, 2017, SemiWiki: Embedded FPGA IP Update — 2nd generation architecture, TSMC 16FFC, and a growing customer base. 0 & Multi-Protocol 25G PHY in TSMC 12FFC : DesignWare PCIe 4. The EFLX4K DSP IP core is identical except some LUTs are replaced with MACs: 3K LUT4s, 1Kb of Distributed Memory, 40 MACs (22x22 multiplier with 48 bit. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC's N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers' SoC timing and clock demands. About TSMC 16FFC and 16FF+ Processes. In recognition of ANSYS' comprehensive. 5K IP cores now available in TSMC 16FFC/FF+/12FFC. Our newest addition to the N16/N12 families are the 16FFC+ and 12FFC+. Versus 12FFC, 12FFC+ improves same-power speed by 7% and same-speed power by 15%. Arm Artisan 12FFC mainstream mobile solution Arm Cortex-A75 / Cortex-A55 and Cortex-A73 / Cortex-A53 POP IP •Enables fast transition from 16FFC to 12FFC and provides optimized performance and area Multiple PPA targets enable flexible Arm big. Notably, the company has a mixed record of earnings surprises in the trailing four quarters, with an average. Looking at TSMC's roadmap, I'd say this means planar 22nm or 16FFC at best. ANSYS recognized for leading-edge power and reliability analysis solutions. Production capacity of these two fabs is hundreds of thousands wafer starts per quarter and TSMC plans to ship 400 thousand wafers processed using its 10 nm. TSMCのロードマップでは、従来の16nmプロセス、最新の10nmプロセス、次世代の7nmプロセスのほかに、少し前から12nmプロセスが登場している。. We also extended our 16-nanometer offerings with 12FFC+ and 16FFC+ in 2019 to support customer needs in ultra-low-power applications. Silicon Creations will showcase its technologies in these and other nodes at TSMC's OIP Ecosystem Forum. For low-end to mid-range product applications, TSMC will offer 12FFC, 16FFC, 28nm Low Power (LP), 28nm High Performance Low Power (HPL), 28HPC, 28HPC+, and 22ULP logic process technologies in addition to comprehensive IPs to satisfy customer needs for high-performance and low-power chips. , announced today that MorningCore Technology, a subsidiary of China telecommunications giant Datang, is licensing EFLX4K eFPGA for TSMC’s 12nm FinFET Compact technology (12FFC) process and the EFLX Compiler for programming the eFPGA. "This initial set of protocols demonstrates the versatility of this IP, which we ported to TSMC's 12FFC and 16FFC processes from the PMA we built for Microchip Technology's PolarFire FPGA. [email protected] Cadence has been working closely with key 16FF+ and 16FFC customers for the past few years and is beginning to work with customers adopting the 12FFC process to develop next-generation applications processors for smartphones and tablets as well as high-end consumer applications. 05, 2017 – With state-of-the-art power and reliability analysis solutions, TSMC and ANSYS enable customers to confidently develop next-generation mobile, high performance computing and automotive applications. And ANSYS is collaborating with TSMC on a suite of solutions for fan-out technology, including multi-die analysis for extraction, power, reliability, signal and power integrity, and thermal and electromagnetic interference. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. 12FFC should deliver 10% speed gain, 20% power reduction and 20% increased logic density vs 16FFC through dual-pitch BEOL, device boost, 6-track stdcell library and 0. 作为tsmc广泛采用的16ffc流程系列的一部分,12ffc得到了全面设计生态系统和完整ip产品组合的支持,其中包括高压i / o(5v hvmos),以实现从成熟节点顺利进行设计移植。. But we were still missing some parameters like the manufacturing process, max CPU and GPU frequencies, and so on. <-- Tom Dillinger*04-30-2019 12FFC will ramp to over 50% of 16FFC by end of 2019 (I think that this meant 12FFC will be over half the combined 16/12FFC volume). Cadence Design Systems, Inc. , leverage your professional network, and get hired. 7x the power of 16FFC process. Looking over at the iFixit teardown of the iPhone 7 PLus we see STMicroelectronics has also scored design wins into the iPhone 7 PLus. The term "16 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. Il s'agit de la quatrième version du 16nm de TSMC après le 16FF, le 16FF+, et le 16FFC, un process qui avait été vaguement évoqué en janvier dernier. Answer me this: If Samsung is poised to leave TSMC in its wake, why has its (and TSMC's) largest customer, Apple, ditched Samsung for the A10 with insider talk pointing to Samsung's ramp, yield, and heat/power issues. 12FFC IP Collaboration. 0 & Multi-Protocol 16G PHY in TSMC 12FFC. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan) (If a change in meeting venue is warranted due to COVID-19 epidemic. The DesignWare Interface, Analog and Foundation IP will help designers accelerate development of mobile SoCs that incorporate logic libraries, embedded memories, embedded test and repair, USB 3. Channel Lengths include 16nm, 18nm, 20nm and 24nm; 6-track available only on 12FFC; Download Product Overview. Dan Hutcheson of VLSI Research. — MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC. 3, DDR4/3, LPDDR4X, PCI Express 4. ) which is specified under the Mx section in the DRM. 台積電在半導體行業的地位毋庸置疑。台積公司在台灣設有三座十二吋超大晶圓廠、四座八吋晶圓廠和一座六吋晶圓廠,並擁有一家百分之百持有之海外子公司—台積電有限公司之十二吋晶圓廠及兩家百分之百持有之海外子公司—WaferTech美國子公司、台積電有限公司之八吋晶圓廠產能支援。. DesignWare PCIe 5. TSMC Awards recognize Synopsys' Collaboration on Interface IP, Joint Development of 7nm FinFET Plus and 12FFC Design Infrastructures and Joint Delivery of an Automotive Design Enablement Platform Sep 11, 2017. TSMC의 5nm 공정은 N5와 N5P의 두 가지 버전이 있습니다. APPLICATION NOTE 7 nm technology Page 5/22 etienne. The foundry's 16nm FinFET processes consisting of 16FF (16nm FinFET), 16FF+ (16nm FinFET Plus) and 16FFC (16nm FinFET Compact) will generate more than 20% of its total wafer revenues in 2016. As the world’s largest pure-play foundry, TSMC pioneers advanced process nodes for leading-edge semiconductor design companies. For those customers looking for leading-edge process technologies, the Cortex-A75 and Cortex-A55 POP IP for TSMC 7FF also will be available by Q4 2017. This process maximizes die cost scaling by simultaneously incorporating optical shrink and process simplification. What is the use of PODE and CPODE layers in tsmc 16nm technology. 067GHz Operation •4K MACs @ INT8x8/16x8 or 2K MACs @ INT16x16/BF16 •Winograd acceleration for INT8 •8MB L2 SRAM + 4MB L3 SRAM •x32 LPDDR4 (16GB/s peak BW) •Partners: TSMC, GUC, Synopsys, Arteris, Analog Bits, Cadence, Mentor •Available as Chip & PCIe Board x32 GPIO 4K MACs 8MB distributed L2 SRAM. Moortec, provides in-chip monitor IP for performance, voltage and temperature, which can be used as part of a feedback loop for voltage and frequency scaling of processors and as part of protection. 0 & Multi-Protocol 32G PHY in TSMC 16FFC : PCIe 4. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC’s N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers’ SoC timing and clock demands. The application involves wireless. Provided feedback on Design to Frontend team. Im Vergleich zu 14 nm verbessert der N+1-Prozess von SMIC die Leistung um 20 %. com provides the world's largest catalog of semiconductor IP cores. Page 4 - Seeking answers? Join the AnandTech community: where nearly half-a-million members share solutions and discuss the latest tech. Planning a design using TSMC’s new 12 FFC or 7 nm V1. TSMC also introduced a more cost-effective 16nm FinFET Compact Technology (16FFC),which entered production in the second quarter of 2016. Notably, the company has a mixed record of earnings surprises in the trailing four quarters. GlobalFoundries on Wednesday announced its new 12LP (leading performance) fabrication process. The most powerful and smartest chip ever in a smartphone said by Phil Schiller, the vice president of Apple, indicating its superior performance than others. 2-ch 24-bit 192KSPS Audio DAC; TSMC 40nm LP: Developing: TSMC: 28nm: HPCP: SP-24ADAC-T28HPCP: 2-ch 24-bit 192KSPS Audio DAC; TSMC 28nm HPC+: Silicon proven: TSMC: 40nm: LP: SP-4VDAC-T40LP: 4 channel. The IP portfolio is recharacterized and revalidated. 16FFC: 10% same-power speed, 20% same-speed power 12FFC+ vs. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform ® (OIP) Ecosystem Forum. 12FFC is an optical shrink of 16FFC which means the design rules are the same (only scaled of course), the same layers, same SRAM cell layout, same voltage range, same I/O devices. 28HPC, 28HPC+,16FFC, 12FFC, 7FFC for mainstream smartphone and automotive 50ULP,28HPC+, 28ULP, 22ULP, 12FFC/ULP for low power applications and IoT Sieht wie du sagst eher höchstens nach Xavier in 12nm aus, aber eine Sache versteh ich nicht:. Flex Logix eFPGA cores are silicon proven and available in TSMC 40 LP/ULP, 22ULP, 28HPC/HPC+, 16FFC, 12FFC and Global. TSMC는 12나노핀펫콤팩트(12FFC) 공정을 개발 중이며 2019년 양산할 계획이다. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. Synopsys has teamed up with TSMC to develop an IP portfolio for TSMC's 12nm FinFET process. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. TSMC decided to make 16FFC their automotive process node. In recognition of ANSYS' comprehensive. According to the company, the third-generation Artisan FinFET platform is optimised for TSMC 16FFC process and will allow the company's SoC partners to design the power-efficient, high performance implementations of Cortex-A73 for mobile and other consumer applications for appropriately-prced for the mass-market. [email protected] As a part of TSMC's widely-adopted 16FFC family of processes, 12FFC is supported by a comprehensive design ecosystem and a complete IP portfolio, including high-voltage I/O (5V HVMOS) to enable smooth design migration from mature nodes. Customers have already embedded the NeoFuse IP for product tape. 84GHz, while the A73 cores reach up to 2. is a Taiwanese fabless semiconductor company that provides chips for wireless communications, High-definition television, handheld mobile devices like smartphones and tablet computers, navigation systems, consumer multimedia products and Digital subscriber line services as well as optical disc drives. 16FFC / 12FFC技术. Cadence’s certification for version 1. The package consists of the safety-certified ARM. The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Moving from TSMC 28nm to TSMC 16nm FinFET can be done easily: 9 track or10. It first appeared in the iPhone 7 and 7 Plus which were introduced on September 7, 2016. The awards for the joint development of the 7nm FinFET Plus design infrastructure and 12FFC design infrastructure were awarded based on the early, in-depth collaboration between TSMC and Cadence. eFPGA IP cores for TSMC 12FFC/FFC+/16FF+/FFC/FFC+ The EFLX4K Logic IP core is an eFPGA IP core contains 4K LUT4, 21Kb of Distributed Memory and has 632 input pins and 632 output pins. iPhone 8/8 Plus/X의 심장부로 애플이 개발한 새로운. About TSMC 16FFC and 16FF+ Processes 16FFC is a "compact" version of TSMC's 16FF+ process. metal pitch. 先说结论:符合预期,AI是风潮也是牛皮,大家都被10nm坑了-----1、今年10nm各家都是坑今年的10nmSOC可谓全面吹牛皮了。高通835是不是看起来很厉害啊?. ” “Our 12FFC process has gathered significant interest from customers,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. 0 at 16GT/s : x1 : DesignWare PCIe Controller and PHY IP : Dec 06, 2019 : Synopsys : DesignWare PCIe 4. 0GHz in TSMC’s 16FFC (or 12FFC) process, yielding 512GMAC/s per tile for INT8 data. Arm Artisan 12FFC mainstream mobile solution Arm Cortex-A75 / Cortex-A55 and Cortex-A73 / Cortex-A53 POP IP •Enables fast transition from 16FFC to 12FFC and provides optimized performance and area Multiple PPA targets enable flexible Arm big. TSMC 7nm will have the same transistor density as Intel 10nm and the fact that TSMC is having a 7nm high performance version optimized for enabling 4 Ghz clock trees is a good sign that the ARM. The P60 is the first mobile SoC to come manufactured on TSMC's new 12nm 12FFC process node. 12 track For easer power grid creation and DRC fixing, use ARM's Power Grid Architect Inverter usage is recommended for clock tree synthesis. Xbox One S uses 16nm APU from AMD, overclocked 61MHz over Xbox One. Cadence Design Systems Inc. Additional Background on the 12FFC Process and TSMC IoT Platform As a part of TSMC's widely-adopted 16FFC family of processes, 12FFC is supported by a comprehensive design ecosystem and a complete IP portfolio, including high-voltage I/O (5V HVMOS) to enable smooth design migration from mature nodes. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform® (OIP) Ecosystem Forum. EFLX-100 is available now for TSMC 16FF+/FFC. Arm Artisan 12FFC mainstream mobile solution Arm Cortex-A75 / Cortex-A55 and Cortex-A73 / Cortex-A53 POP IP •Enables fast transition from 16FFC to 12FFC and provides optimized performance and area Multiple PPA targets enable flexible Arm big. Quantenna Connectivity Solutions, a division of ON Semiconductor, is a global leader and innovator of leading-edge performance Wi-Fi solutions that offer superior performance, and establish benchmarks for speed, range, efficiency and reliability. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform ® (OIP) Ecosystem Forum. Read the latest news and Press about Mentor, a Siemens Business. 당시에 논란을 언급하면서 간단히 공정 성능을 비교했었는데, (링크 : 애플 A9 논란에 관하여. TSMC’s advanced packaging solutions enable system integration with wafer level process, by seamless integration of front end wafer process and backend chip packaging. The eight clusters are surrounded by the XFLX interconnect, which configures the data flow. 10nm: TSMC Is Steady. Cela se fera via 16FF+ (FinFet+) destiné aux produits les plus performants mais aussi nouveau 16FFC (FinFet Compact) pour le moyen de gamme et la basse consommation. Tsmc Library Download. (Nasdaq: SNPS) today announced a broad IP portfolio for TSMC’s 16-nanometer FinFET Compact (16FFC) process for reliable integration into cost-sensitive, ultra-low power applications including mobile, Internet of Things (IoT), digital home and automotive. May 31, 2017, Electronics Weekly: Flex Logix eFPGA cores enable 100K LUTs. Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platform. Dan Hutcheson of VLSI Research. Development and qualification of the IP meets ISO 26262 for functional safety and AEC-Q100 Grade 1. It’s interesting that Kirin 960’s A73 cores are clocked lower than the Kirin 955’s 2. Technology and Cost Trends at Advanced Nodes Scotten W. Thus, the ULP variant of manufacturing process has been aimed at ICs for wearable equipment and for the Internet of Things (IoT). (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform® (OIP) Ecosystem Forum. (12FFC) design infrastructure and the joint delivery of the automotive design enablement platform. It's more like "either/or" rather than "both/and". Of course, given the name, you will guess that this is a process derived from 16FFC, the third generation process that TSMC introduced for consumer products (although the. (Nasdaq: SNPS) today announced a broad IP portfolio for TSMC's 16-nanometer FinFET Compact (16FFC) process for reliable integration into cost-sensitive, ultra-low power applications including mobile, Internet of Things (IoT), digital home and automotive. 从麒麟970来看,TSMC 10nm宣称数据只能和16FFC的960对上去。 随后就是即将量产的台积电7nm了,根据TSMC的宣称,7nm比起10nm,做到了1. Cadence Design Systems, Inc. Cadence is actively working with customers on early engagements with the 12FFC process. LAWRENCEVILLE, GA -- October 1, 2018 -- Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC's 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer's SoC timing demands. Well, the only case without uArch changes (Kirin 960 vs Kirin 970) is not that rosy. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC's N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers' SoC timing and clock demands. Additional Background on the 12FFC Process and TSMC IoT Platform. 16FFC is fairly recent, and aimed at lower-cost 16nm designs and mobile. Looking over at the iFixit teardown of the iPhone 7 PLus we see STMicroelectronics has also scored design wins into the iPhone 7 PLus. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC's 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer's SoC timing demands. 12FFC+ :与12FFC相比,+7% perf @恒功率,+15% [email protected]恒定 perf. Today at the TSMC Technology Symposium, Cliff Hou, TSMC's VP of R&D, is set to announce the latest member of TSMC's process portfolio, 12FFC. 0 at 16GT/s : x1 : DesignWare PCIe Controller and PHY IP : Dec 06, 2019 : Synopsys : DesignWare PCIe 4. Cadence’s certification for version 1. 2018年10月に米国のサンタクララにて開催予定のArm TechCon 2018において発表されるArmの最新情報を日本でご紹介するとともに、日本のお客様向けに、Armおよびパートナー企業様からの技術・マーケティング情報をご紹介する、年に一度のArm主催のプライベートカンファレンスです。. Please login Quick Navigation Analog Integrated Circuit (IC) Design, Layout and Fabrication Top. theaudiopedia. 5-track, High Performance & High Density (with or without CPODE, 90nm or 96nm poly pitch). 10nmに見切りをつけ低コストの12ffcに注力 tsmc 半導体ロードマップ. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. Cadence Design Systems has announced a broad portfolio of Cadence interface and Denali memory IP solutions for automotive applications supporting TSMC’s 16nm FinFET Compact (16FFC) process. In recognition of ANSYS' comprehensive solutions, TSMC presented ANSYS with three awards at. Cadence Recognized with Three TSMC Partner of the Year Awards: Cadence Design Systems, Inc. 55V, with data demonstrating significantly improved statistical process control. Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platform. 2X vs the 7. The "C" stands for compact, and the new node is intended for use in mainstream and low-power markets. The standard cell library typically contains both logical and physical representations for use with standard place and route tools. Of course, given the name, you will guess that this is a process derived from 16FFC, the third generation process that TSMC introduced for consumer products (although the. TSMC's 28HPC High K Metal Gate process offer improvements in process rules and variability to enable smaller designs, at higher performances, using less power. Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology Highlights: - Using Cadence tools and IP with TSMC's 12FFC process, SoC designers can create mid-range mobile. TSMC MS/RF technology supports multiple communication applications, including smartphones, wireless, Bluetooth, and others. Nintendo Switch SoC - 4x NVIDIA Custom ARM A73 + 4x Cortex A53, Pascal 512 CUDA Cores 16nm FFC. As for TSMC, its 10 nm process technology (CLN10FF) is now qualified for production at the company's GigaFabs 12 and 15, where high-volume ramp is expected to start in H2 2017. 12 track For easer power grid creation and DRC fixing, use ARM's Power Grid Architect Inverter usage is recommended for clock tree synthesis. GTX 980 Ti vs. Como hemos mencionado anteriormente, nuestra A1778 iPhone 7 tenía un procesador A10 aplicación de TSMC. Taiwan-based eMemory has announced the availability of NeoFuse technology qualified for TSMC's 16nm FinFET compact (16FFC) process. 16FFC / 12FFC 技术. Cadence has been working closely with key 16FF+ and 16FFC customers for the past few years and is beginning to work with customers adopting the 12FFC process to develop next-generation applications processors for smartphones and tablets as well as high-end consumer applications. 12 Track Ultra-High Speed Standard Cell Library (HSSC) in TSMC (16nm/12nm, 16FFC, 12FFC, 28HPC+, 40LP) M31 provides the 12 track ultra-High Speed Standard Cell library (HSSC) in 16/12nm FinFET technology nodes. TSMC’s 12nm appears to be. ) which is specified under the Mx section in the DRM. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan) (If a change in meeting venue is warranted due to COVID-19 epidemic. 7x the power of 16FFC process. , June 9, 2020 Place: TSMC’s Headquarters (No. Cadence’s certification for version 1. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. 128 "Hot Product" Solutions. 5K cores from TSMC's 28nm CMOS process to the 16nm FinFET processes. These are the processes where the most active development is going on. Silicon Creations is a leading silicon IP developer with offices in the US and Poland. For some activities that sometimes require an absolute presence at the office, such as administration and laboratory tasks, strict rules have been put in place to keep PLDA’s collaborators safe, along with their families and other people from our communities. TSMC’s 10nm yields have “been too low to boost the process to economies of scale,” the report notes. Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology Highlights: - Using Cadence tools and IP with TSMC's 12FFC process, SoC designers can create mid-range mobile. 1x the speed or 0. 0 & Multi-Protocol 32G PHY in TSMC 16FFC : PCIe 4. Thus, the ULP variant of manufacturing process has been aimed at ICs for wearable equipment and for the Internet of Things (IoT). ” Discussion will include “node design challenges including 7nm, 10nm, 12FFC, 16FFC, 16nm FinFET+, 22ULP, 28nm, and ultra-low power process. Mediatek Helio P70. 0 at 16GT/s : x1 : DesignWare PCIe Controller and PHY IP : Dec 06, 2019 : Synopsys : DesignWare PCIe 4. When all three phases of the manufacturing facility are completed, its wafer starts capacity will exceed one million 300-mm wafers per year, comparable with other three …. Today, news has it that the company’s 16FF yield is much improved and guaranteed for the mass production of Huawei upcoming HiSilicon Kirin 950 chip. TSMC co-CEO CC Wei remarked at the company’s most recent investors meeting that TSMC ‘s share of the 14/16nm foundry market segment will rise above 70% in 2016 from around 40% in 2015. TSMC Announces New 12FFC Process Today at the TSMC Technology Symposium, Cliff Hou, TSMC's VP of R&D, is set to announce the latest member of TSMC's process portfolio, 12FFC. cdl for LVS. Synopsys offers a comprehensive portfolio of more than 100 silicon-proven DesignWare® Data Converter IP products consisting of analog-to-digital converters (ADCs), digital-to-analog converters (DACs), auxiliary converters, video DACs (VDACs) and analog front-ends. 0 Junction Temperature (°C) −40 to 125 Leakage Power 3. 2019年,我們也擴展16奈米技術組合到12奈米精簡型強效版(12ffc+)製程技術及16奈米精簡型強效版(16ffc+)製程技術,以支援客戶在超低功耗應用上的需求。. ANSYS recognized for leading-edge power and reliability analysis solutions. The enhanced process is said to feature lower leakage better and cost characteristics and perhaps a better name (vs. 10nm/7nm FF early partner with TSMC and Samsung 16FFC test chips with PLL and Sensor IP’s tape-out targeted in Dec. 12 Track Ultra-High Speed Standard Cell Library (HSSC) in TSMC (16nm/12nm, 16FFC, 12FFC, 28HPC+, 40LP) M31 provides the 12 track ultra-High Speed Standard Cell library (HSSC) in 16/12nm FinFET technology nodes. 9GB/s peak BW) • 13. TSMC 16FF+/16FFC/12FFC: EFLX 150 (silicon proven) TSMC 40LP/ULP: EFLX 100 (silicon proven) Applications for EFLX 4K eFPGA. Synopsys, Inc. Tsmc Library Download. Otherwise it’s 16FF+ which is what GPUs are using IIRC, and that is indeed from late 2015. While people are used to seeing the high-profile competition between MediaTek and Snapdragon, we have got something new here. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. Synopsys has teamed up with TSMC to develop an IP portfolio for TSMC's 12nm FinFET process. NXP is chasing high-end networking with its newest QorIQ processor, the LX2160A. On April 8, 2020, MediaTek published a post title "Why MediaTek Stands Behind Our Benchmarking Practices", and later that day AnandTech published an article MediaTek's Sports Mode. Well, the only case without uArch changes (Kirin 960 vs Kirin 970) is not that rosy. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a variety of new IP offerings on TSMC's N5, N5P, N7, N7+, 12FFC, and 22ULP and 22ULL processes, designed to support customers' SoC timing and clock demands. TSMC 7nm will have the same transistor density as Intel 10nm and the fact that TSMC is having a 7nm high performance version optimized for enabling 4 Ghz clock trees is a good sign that the ARM. The 12FFC process should start risk production before June and deliver 1. Nitro-SoCTM place and route system is also certified to support TSMC’s 12FFC process technology. 0 & Multi-Protocol 32G PHY in TSMC 16FFC : PCIe 4. theaudiopedia. Compared to 28HPC+, both 16FF+ and 16FFC provide more than 40% speed improvement, and more than 80% leakage reduction. 5K will be available in early 2017 for TSMC 16FF+/FFC. 16FFC / 12FFC技术. Cadence Recognized with Three TSMC Partner of the Year Awards. 0 at 16GT/s : x1 : DesignWare PCIe Controller and PHY IP : Dec 06, 2019 : Synopsys : DesignWare PCIe 4. HSINCHU, Taiwan R. Nintendo Switch SoC - 4x NVIDIA Custom ARM A73 + 4x Cortex A53, Pascal 512 CUDA Cores 16nm FFC. We also extended our 16-nanometer offerings with 12FFC+ and 16FFC+ in 2019 to support customer needs in ultra-low-power applications. 0 & Multi-Protocol 16G PHY in TSMC 12FFC. Jones - President - IC Knowledge LLC. 从麒麟970来看,TSMC 10nm宣称数据只能和16FFC的960对上去。 随后就是即将量产的台积电7nm了,根据TSMC的宣称,7nm比起10nm,做到了1. 新しいtsmcの12ffcプロセスは、性能とコストのメリットに加えてfinfetプロセスのメリットを提供します。 TSMCとの協業により、ケイデンスのツールおよびIPは、共通のお客様が使い慣れたツールやフローを使用して積極的に、新興の市場をターゲットとすること. , June 9, 2020 Place: TSMC’s Headquarters (No. One of the first mainstream 7 nm mobile processor intended for mass market use, the Apple A12 Bionic, was released at their September 2018 event. The NMAX compiler will be available at the same time. TSMC's new 28HPC+ process takes this improvement one step further and provides a hard-to-resist platform. In packaging, TSMC is working on a new variant of InFO, its wafer-level fab-out technique used in Apple's latest A Series processors. Of course, given the name, you will guess that this is a process derived from 16FFC, the third generation process that TSMC introduced for consumer products (although the. Technology 12FFC+/FFC/16FFC+/FFC/FF+ Metal Stack 7 metal layers: M1+2Xa_1Xd_h_3Xe_vhv Nominal Supply Voltages (Vj) 16FFC: 0. For those customers looking for leading-edge process technologies, the Cortex-A75 and Cortex-A55 POP IP for TSMC 7FF also will be available by Q4 2017. 7x the power of 16FFC process. 1/DisplayPort 1. If you have even a little bit of knowledge of mathematics and rounding, you should see that my Intel estimate (still an estimate based on 22->24) rounds to the same 0. ARM has introduced a set of IP cores – the Cortex-A76 CPU, the Mali-G76 GPU and the Mali-V76 vision processing unit – that will allow licensees to build a high-performance laptop processor, a doubling of performance over current ARM-based laptop CPUs, the company claims. 10nmに見切りをつけ低コストの12FFCに注力 TSMC 半導体ロードマップ – ASCII. TSMC's 5 nm (CLN5) technology will increase the usage of EUV tools and this will bring rather massive advantages when it comes to transistor density: TSMC is touting a 1. • Short lived half node for TSMC. TSMC and its customers jointly unleash a number of innovations in the MS/RF segment and account for a 75% share of this market. The 12FFC process should start risk production before June and deliver 1. 10nm/7nm FF early partner with TSMC and Samsung 16FFC test chips with PLL and Sensor IP’s tape-out targeted in Dec. - Developed soft IP physical design flows for graphics core in TSMC 28nm and Intel 14nm nodes. These are the processes where the most active development is going on. Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC by Anton Shilov on May 5, As for TSMC, its 10 nm process technology (CLN10FF) is now qualified for production at the. On April 8, 2020, MediaTek published a post title "Why MediaTek Stands Behind Our Benchmarking Practices", and later that day AnandTech published an article MediaTek's Sports Mode. Of course, given the name, you will guess that this is a process derived from 16FFC, the third generation process that TSMC introduced for consumer products (although the. 台积电在半导体行业的地位毋庸置疑。但他们究竟有多强大,大部分读者了解得可能非常片面。让我们从他们最新公布的2019年财报里,一窥台积电的真正实力。. " XFX has a model that's. 6V to support ultra-low power. ICpedia, an IC Design and verification center that is working exclusively for Synopsys Inc. This broad IP portfolio enables a host of applications ranging from in-vehicle infotainment, in-cabin electronics, vision subsystems, digital noise reduction and advanced driver assistance system (ADAS) subsystems and is registered in the. 16FF+ is not the only FinFET node coming from TSMC over the next year. Quote Intel is encountering tight 14nm process production capacity in-house, and is looking to outsource part of its 14nm chip production to Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources. 5nm,TSMC和GF 7nm工艺实际是8. TSMC EUV layer N5 volume ramp 1H20 Future AMD Ryzen CPUs Can Boost Transistor Density By 80% and Feature 15% Speed Gain With TSMC’s Bleeding Edge 5nm Process Node In a report published by PCGamesN, it is stated that if AMD was to utilize TSMC’s latest 5nm node, also dubbed as N5, the company may expect an uplift of 80% in transistor density, 15% in overall performance and a 45%. < Previous Post in Thread: Next Post in Thread > Topic Posted By Date;. 16nm FinFET technology; TSMC fabs fully-functional networking processor September 25, 2014 // By Graham Prophet TSMC in collaboration with HiSilicon Technologies (Shenzhen, China) has announced that it has produced the foundry segment's first fully-functional ARM-based networking processor with FinFET technology. Mentor Graphics announces further certification of design tools for TSMC 12FFC and 7nm processes (Mar 17, 2017) MediaTek to roll out 12nm product in 2H17 (Mar 16, 2017) SMIC to enter 7nm R&D, says. Side-Channel Attack TVC Sensors in TSMC. Níže uvedená věta pochází z materiálů TSMC a doslovně ji na svých webech citují prakticky všichni zákazníci, kteří ohlásili využití 12nm procesu TSMC: „This year is the launch of 12FFC with 1. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. 喜欢 传中芯国际14纳米FinFET后年量产 达普芯片交易网 (0). 40 nm Process. Today at the TSMC Technology Symposium, Cliff Hou, TSMC's VP of R&D, is set to announce the latest member of TSMC's process portfolio, 12FFC. This year, TSMC aims to spend about $10. 0 Deliverables • Verilog behavioral modules for PHY module • Verilog testbench with configuration files and sample tests. ANSYS Wins Three TSMC Partner of the Year Awards. 4Mbit attached SRAM, PLL & PVT) for customers to test. Moving from TSMC 28nm to TSMC 16nm FinFET can be done easily: 9 track or10. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Moortec temperature monitor now on TSMC 16FF+ and 16FFC January 24, 2017 // By Peter Clarke The temperature sensor is a complement to the voltage sensor announced for the same 16nm processes in 2016 (see Moortec's voltage monitor now on TSMC 16FF+ & FFC ). , announced today that MorningCore Technology, a subsidiary of China telecommunications giant Datang, is licensing EFLX4K eFPGA for TSMC’s 12nm FinFET Compact technology (12FFC) process and the EFLX Compiler for programming the eFPGA. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan) (If a change in meeting venue is warranted due to COVID-19 epidemic. Mentor Graphics Reports Q4 EPS $1. Cadence has been working closely with key 16FF+ and 16FFC customers for the past few years and is beginning to work with customers adopting the 12FFC process to develop next-generation applications processors for smartphones and tablets as well as high-end consumer applications. About TSMC 16FFC and 16FF+ Processes. 5K LUTs so that these companies and agencies can reconfigure RTL at any point. Taiwan Semiconductor Manufacturing Company (tsmc) with 10 nm node. 12FFC is an optical shrink of 16FFC which means the design rules are the same (only scaled of course), the same layers, same SRAM cell layout, same voltage range, same I/O devices. Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process PR Newswire 960d Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in. The information on this site, and in its related newsletters, is not intended to be, nor does it constitute, investment. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. The 12FFC process should start risk production before June and deliver 1. The process operates at a nominal voltage of 0. Dolphin provides a wide range of Memory Compilers and Specialty Memory (ROM, Multi-Port RF, CAM, etc. TSMC had finished developing 16-nano FFC process in 4th quarter of last. 製造プロセスはtsmcのプロセスで表されており、サーバー向けの早いもので“n7”、デスクトップ・ノートpc向けが立ち上がる頃は“n7+”が想定されている模様(産業向けは12ffcや16ffcも想定している)。. — MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry's first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC. Furthermore, 12nm FinFET Compact Technology (12FFC) drives gate density to the maximum, for which entered production in the second quarter of 2017. Ultra High Density (with or without CPODE, 96nm poly pitch; available only on 12FFC) 7. Nvidia's Tesla V100 was the first product to use it, reaching production late last year, but MediaTek also adopted this process for its P60 and now the P22. 5K and EFLX-100 cores are available in TSMC 16FFC/FF+/12FFC. Each year, TSMC conducts two major customer events worldwide - the TSMC Technology Symposium in the Spring and the TSMC Open Innovation Platform Ecosystem Forum in the Fall. 0 at 16GT/s : x1. It’s interesting that Kirin 960’s A73 cores are clocked lower than the Kirin 955’s 2. Please login Quick Navigation Analog Integrated Circuit (IC) Design, Layout and Fabrication Top. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform® (OIP) Ecosystem Forum. LAWRENCEVILLE, GA -- October 2, 2018 -- Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC's 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer's SoC timing demands. The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. cn im vierten Quartal mit einer Kleinserienproduktion gestartet. 5-track, High Performance & High Density (with or without CPODE, 90nm or 96nm poly pitch). 0 & Multi-Protocol 32G PHY in TSMC 16FFC : PCIe 4. Dolphin Technology has assembled a core team of experienced Standard Cell design veterans that have created an extensive offering of highly optimized Standard Cell libraries. Cadence flows obviously are supporting these processes. fr This paper describes the implementation of a high performance FinFET-based 7-nm CMOS Technology in Microwind. Today at the TSMC Technology Symposium, Cliff Hou, TSMC's VP of R&D, is set to announce the latest member of TSMC's process portfolio, 12FFC. The process operates at a nominal voltage of 0. TSMC provides foundry's most advanced and comprehensive portfolio of Mixed Signal/RF CMOS (MS/RF) technology. 16FFC / 12FFC 技术. Pretty simple, TX2 is produced on 16FFC and TX1+ is produced on 12FFC, both via TSMC. DesignWare PCIe 5. 16ffcに対して12ffcでは10数%のエリア縮小になるとされている。 また、消費電力も16FFCに対して下がり、電力削減分を性能に回せば性能もアップする。. Also, there is an optical shrink of 16FFC called 12FFC. ANSYS recognized for leading-edge power and reliability analysis solutions. 0 at 16GT/s : x1 : DesignWare PCIe Controller and PHY IP : Dec 06, 2019 : Synopsys : DesignWare PCIe 4. The DesignWare Interface, Analog and Foundation IP will help designers accelerate development of mobile SoCs that incorporate logic libraries, embedded memories, embedded test and repair, USB 3. Dolphin Technology maintains a broad IP portfolio of Memory Compilers, Specialty Memory and Memory Test & Repair (Memory BIST), providing SoC designers with solutions optimized for low power, high performance and high density across a broad range of process technologies. It is an optical shrink. + Established flows for top-level floorplan, timing budgeting, global clock tree. Furthermore, 12nm FinFET Compact Technology (12FFC) drives gate density to the maximum, for which entered production in the second quarter of 2017. Flex Logix's EFLX4K eFPGA IP core, in both Logic and DSP versions, has been fully validated on TSMC's 16FFC process. 0 & Multi-Protocol 25G PHY in TSMC 12FFC. Compared with 16FFC, 16FFC+ has improved 10% same-power speed or 20% same-speed power. 당시에 논란을 언급하면서 간단히 공정 성능을 비교했었는데, (링크 : 애플 A9 논란에 관하여. 16FFC / 12FFC技术. Additional Background on the 12FFC Process and TSMC IoT Platform. By offering a wide array of IP using TSMC’s 16FFC process, Cadence is enabling automotive customers to accelerate time to market while gaining the benefits of TSMC’s most advanced process. Search over 200 of the world's largest IP suppliers and foundries. 5 Track cell. Tsmc Library Download. 257 2019 – Achronix Semiconductor Corporation , a leading provider in FPGA-based hardware accelerator devices and high-performance eFPGA IP, has joined the TSMC IP Alliance Program, a key component of TSMC Open Innovation Platform (OIP). Notably, the company has a mixed record of earnings surprises in the trailing four quarters, with an average. 製造プロセスはtsmcのプロセスで表されており、サーバー向けの早いもので「n7」、デスクトップ・ノートpc向けが立ち上がる頃は「n7+」が想定されている模様(産業向けは12ffcや16ffcも想定)。. 5T on the 16FFC node. 新しいtsmcの12ffcプロセスは、性能とコストのメリットに加えてfinfetプロセスのメリットを提供します。 TSMCとの協業により、ケイデンスのツールおよびIPは、共通のお客様が使い慣れたツールやフローを使用して積極的に、新興の市場をターゲットとすること. Moving from TSMC 28nm to TSMC 16nm FinFET can be done easily: 9 track or10. 0 at 16GT/s : x1 : IP Demonstration Platform : Nov 05, 2019 : Synopsys : DesignWare PCIe 4. Why Nintendo not use TSMC third generation 16nm FFC process which is 50% more power efficient than Pascal's TSMC second generation 16nm FF+ process? Discussion 16FFC simplifies the process, reducing manufacturing cycle time; reduces SRAM area; optimizes die size; tightens SPICE corners; and can run below 0. 그것은 tsmc의 16ffc 프로세스를 사용하는 것이다. General Purpose Temperature Sensor in Globalfoundries 22nm FD-SOI. 12FFC is an optical shrink of 16FFC which means the design rules are the same (only scaled of course), the same layers, same SRAM cell layout, same voltage range, same I/O devices. Taiwan Semiconductor Manufacturing Company (tsmc) with 10 nm node. May 31, 2017, Electronics Weekly: Flex Logix eFPGA cores enable 100K LUTs. PITTSBURGH, Nov. По-добро е, както и по-малко с 6 инча, и по-скъпо с 380 лв. 5T on the 16FFC node. "We think embedded FPGA will be a pervasive market. 0 & Multi-Protocol 32G PHY in TSMC 16FFC : PCIe 4. has announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform (OIP. 2019年の自作パーツの動向を占う「PCテクノロジートレンド」。各ファウンダリのプロセスを解説する。前回のTSMC/Samsungに続いて、今回は苦境が. Moortec, provides in-chip monitor IP for performance, voltage and temperature, which can be used as part of a feedback loop for voltage and frequency scaling of processors and as part of protection. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. Mentor Graphics announces further certification of design tools for TSMC 12FFC and 7nm processes (Mar 17, 2017) MediaTek to roll out 12nm product in 2H17 (Mar 16, 2017) SMIC to enter 7nm R&D, says. For low-end to mid-range product applications, TSMC will offer 12FFC, 16FFC, 28nm Low Power (LP), 28nm High Performance Low Power (HPL), 28HPC, 28HPC+, and 22ULP logic process technologies in addition to comprehensive IPs to satisfy customer needs for high-performance and low-power chips. Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process PR Newswire 960d Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in. Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property , announced a variety of new IP offerings on TSMC’s N5, N5P, N7, N7+, 12FFC, and 22ULP. Taiwan Semiconductor Mfg. During IR to present yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. Compared to 28HPC+, both 16FF+ and 16FFC provide more than 40% speed improvement, and more than 80% leakage reduction. The important bit is that Volta & Turing means Nvidia has fully split their design branches. 製造プロセスはtsmcのプロセスで表されており、サーバー向けの早いもので“n7”、デスクトップ・ノートpc向けが立ち上がる頃は“n7+”が想定されている模様(産業向けは12ffcや16ffcも想定している)。. ) optimized to meet even the most demanding requirements for high performance, high density and low power. 128 "Hot Product" Solutions. TSMC tenait la semaine dernière son Technology Symposium, l'occasion pour le fondeur taiwanais d'officialiser la dernière version de son process 16nm, le 12FFC. Arm Artisan 12FFC mainstream mobile solution Arm Cortex-A75 / Cortex-A55 and Cortex-A73 / Cortex-A53 POP IP •Enables fast transition from 16FFC to 12FFC and provides optimized performance and area Multiple PPA targets enable flexible Arm big. TSMC's 5 nm (CLN5) technology will increase the usage of EUV tools and this will bring rather massive advantages when it comes to transistor density: TSMC is touting a 1. 5 track architecture for standard cells gives similar performance vs. 0 & Multi-Protocol 16G PHY in TSMC 12FFC : DesignWare PCIe 4. 0 Junction Temperature (°C) −40 to 125 Leakage Power 3. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. TSMC’s 12nm appears to be. メインストリーム:16ffc→12ffc→7ffc 16FF+と10FFの合間というか、10FFと並行する形で12FFNが挟まっていたりするので、ちょっと分かりにくいので. Technology 12FFC+/FFC/16FFC+/FFC/FF+ Metal Stack 7 metal layers: M1+2Xa_1Xd_h_3Xe_vhv Nominal Supply Voltages (Vj) 16FFC: 0. ANSYS Wins Three TSMC Partner of the Year Awards. Cadence Design Systems, Inc. High performance, consumer cost, and with already a couple of years of volume manufacturing experience. TSMC has only disclosed 2 significant figures: the 2 and the 7. By: juanrga (nospam. Mountain View, Calif. Our newest addition to the N16/N12 families are the 16FFC+ and 12FFC+. 당시에 논란을 언급하면서 간단히 공정 성능을 비교했었는데, (링크 : 애플 A9 논란에 관하여. TSMC 16FF+/16FFC/12FFC: EFLX 150 (silicon proven) TSMC 40LP/ULP: EFLX 100 (silicon proven) Applications for EFLX 4K eFPGA. It is likely that we might see some known Android chipset manufacturers basing their upcoming low to mid-tier processor lines on this new fabrication process. Synopsys provides a comprehensive set of test. 22FFL-Fertigungsprozess: Intel macht Globalfoundries und TSMC direkte Konkurrenz. Níže uvedená věta pochází z materiálů TSMC a doslovně ji na svých webech citují prakticky všichni zákazníci, kteří ohlásili využití 12nm procesu TSMC: „This year is the launch of 12FFC with 1. Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC by Anton Shilov on TSMC's first-generation CLN7FF will enter risk production in Q2 2017 and will be used for over a. The information on this site, and in its related newsletters, is not intended to be, nor does it constitute, investment. The EFLX150 Logic Core and EFLX4K Logic and DSP cores in TSMC 16FF+/FFC/12FFC use our latest Gen 2 architecture with the following improvements (ALL future EFLX implementations will also be Gen 2 ): (EFLX4K TSMC 16FFC/FF+ and all. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan) (If a change in meeting venue is warranted due to COVID-19 epidemic. For low-end to mid-range product applications, TSMC will offer 12FFC, 16FFC, 28nm Low Power (LP), 28nm High Performance Low Power (HPL), 28HPC, 28HPC+, and 22ULP logic process technologies in addition to comprehensive IPs to satisfy customer needs for high-performance and low-power chips. Moortec, provides in-chip monitor IP for performance, voltage and temperature, which can be used as part of a feedback loop for voltage and frequency scaling of processors and as part of protection. On April 8, 2020, MediaTek published a post title "Why MediaTek Stands Behind Our Benchmarking Practices", and later that day AnandTech published an article MediaTek's Sports Mode. Additional Background on the 12FFC process and TSMC IoT Platform As a part of TSMC's widely-adopted 16FFC family of processes, 12FFC is supported by a comprehensive design ecosystem and a complete IP portfolio, including high-voltage I/O (5V HVMOS) to enable smooth design migration from mature nodes. So it's 16FFC+ which they'll call 12FFC. Wang, who oversees TSMC's fab operations. What Nvidia likely doing is still using 7. Page 4 - Seeking answers? Join the AnandTech community: where nearly half-a-million members share solutions and discuss the latest tech. Woo 博士最后谈到了射频技术和路线图。她提到基于 N16 和 N12 FinFet 的平台技术覆盖广泛,涉及 HPC、移动、消费者和汽车。16FFC 和 12FFC 都表现出强大的采用数据,超过 220 个带。. 0 & Multi-Protocol 16G PHY in TSMC 12FFC : DesignWare PCIe 4. 另外,Intel 10nm工艺实际上是9. A comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology has been delivered by Cadence Design Systems. 0 at 8GT/s : x1. 製造プロセスはtsmcのプロセスで表されており、サーバー向けの早いもので“n7”、デスクトップ・ノートpc向けが立ち上がる頃は“n7+”が想定されている模様(産業向けは12ffcや16ffcも想定している)。. But yes, 10nm is clearly better than 14/16nm. 0 for TSMC 16FFC TSMC 16 FFC PHP IP for USB 2. EFLX-100 is available now for TSMC 16FF+/FFC. 8Vj, 25C Tj) Area (mm2) 1. Our newest addition to the N16/N12 families are the 16FFC+ and 12FFC+. Flex Logix's EFLX4K eFPGA IP core, in both Logic and DSP versions, has been fully validated on TSMC's 16FFC process. TSMC also introduced a more cost-effective 16nm FinFET Compact Technology (16FFC),which entered production in the second quarter of 2016. So it's 16FFC+ which they'll call 12FFC. Technology and Cost Trends at Advanced Nodes Scotten W. Applications for the EFLX 4K eFPGA series include networking (network, security, and storage protocols), acceleration for co-processors, wireless base station DFE, and MCU/MPU reconfigurable I/Os. Moreover, we had completed the characterization in TSMC's 7nm FinFET process in September, 2017 to keep NeoFuse development in leading-edge process nodes at the early stage. For one, there are at least three different 16nm's that TSMC has, and the one that ARM uses could be clocking higher than SS/GF's 14nm too. 67X的能耗比(节约40%的功耗)。官网介绍说7nm将会有一个移动处理器的节点以及一个高性能的优化节点。. 12FFC+、12FFC、16FFC+及16FFC则皆能支援客户主流及超低功耗(Ultra-LowPower, ULP)产品应用,包括中、低阶手机、消费性电子、数位电视、物联网等。总计目前 12FFC+、12FFC、16FFC+、16FFC、16FF+已接获超过 500个客户产品投片,其中绝大部分都是第一次投片即生产成功。. Hence, this by-invitation-only conference offers an important opportunity for TSMC’s “eco-system companies and customers to share practical, tested solutions to today’s design challenges. 今天我们只聊PPT,不谈技术~近日,ARM发布了新一代CPU微架构Cortex-A76和新一代GPU微架构Mali-G76。ARM作为移动计算领域最大的指令集和架构授权厂商,在当前正热门的智能终端领域有着举足轻重的地位。. Anirudh Devgan, executive vice president and general manager of the. As a part of TSMC's widely-adopted 16FFC family of processes, 12FFC is supported by a comprehensive design ecosystem and a complete IP portfolio, including high-voltage I/O (5V HVMOS) to enable smooth design migration from mature nodes. Taiwan Semiconductor Manufacturing Company Limited 2020 Annual Shareholders’ Meeting Meeting Agenda (Translation) Time: 9:00 a. The design is silicon-proven on TSMC’s industry leading 16nm FinFET Compact Technology (16FFC). and manufactured by TSMC. [48] [49] MediaTek said Sports Mode is designed to show full capabilities during benchmarks , that its standard practice in the industry, and their device makers can. The NMAX compiler will be available at the same time. <-- Tom Dillinger*04-30-2019 12FFC will ramp to over 50% of 16FFC by end of 2019 (I think that this meant 12FFC will be over half the combined 16/12FFC volume). Samsung's second-generation 10nm node, 10nm LPP, is now ready for mass production, with further performance and power consumption improvements over its older technology, 10nm LPE. Anirudh Devgan, executive vice president and general manager of the. ARM also released the safety package for its latest-generation C/C++ compilation toolchain, ARM Compiler 6. 16nm FinFET technology; TSMC fabs fully-functional networking processor September 25, 2014 // By Graham Prophet TSMC in collaboration with HiSilicon Technologies (Shenzhen, China) has announced that it has produced the foundry segment’s first fully-functional ARM-based networking processor with FinFET technology. While people are used to seeing the high-profile competition between MediaTek and Snapdragon, we have got something new here. Tsmc Library Download. 4Mbit attached SRAM, PLL & PVT) for customers to test. FlexLogix validates eFPGA cores on TSMC 16nm The EFLX4K eFPGA FlexLogix IP core, both the Logic and DSP versions, have been fully validated on TSMC16FFC. 16nm 16FFC (FinFET) 28nm 28HPC+(HKMG) 28nm 28A 14nm 14+ 14nm 14+ 10nm SoC/HPM 7nm (Non-EUV) Samsung 28nm 28LPH 32nm 32LP 28nm 28LPP 14nm 14LPP (FinFET) 28nm 28LP 14nm 14LPE (FinFET) 14nm 14LPC. The DesignWare Interface, Analog and Foundation IP will help designers accelerate development of mobile SoCs that incorporate logic libraries, embedded memories, embedded test and repair, USB 3. The 16FFC process which has had eight design wins is not yet in volume production. Side-Channel Attack TVC Sensors in TSMC. 3x good excellent System-on-chip capabilities Sense ›Today, SiGe is. 2 東芝レビューVol. Today at the TSMC Technology Symposium, Cliff Hou, TSMC's VP of R&D, is set to announce the latest member of TSMC's process portfolio, 12FFC. Il s'agit de la quatrième version du 16nm de TSMC après le 16FF, le 16FF+, et le 16FFC, un process qui avait été vaguement évoqué en janvier dernier. Silicon Creations Highlights PLL Developments in 22nm, 12nm, 7nm, and 5nm at TSMC OIP™ Ecosystem Forum Contacts Cayenne Communication Michelle Clancy, 503-702-4732 michelle. such as 16nm FinFET Plus (16FF+), 16FFC and 12FFC have proven the quality of NeoFuse IP. 0 for TSMC 12FFC TSMC 12 FFC PHY IP for USB 2. 12FFC IP Collaboration. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain. Introducing 7-nm FinFET technology in Microwind Etienne SICARD Professor INSA-Dgei, 135 Av de Rangueil 31077 Toulouse – France www. [email protected] Why? TSMC claims 16FFC has advantages in power, performance, and area (20% smaller) compared to the existing 16FF+ process, along with easy migration from 16FF+. TSMC’s 16nm 3D-FinFET structure will enable an extensive means of customization to chipsets that will be based on the technology. is a Taiwanese fabless semiconductor company that provides chips for wireless communications, High-definition television, handheld mobile devices like smartphones and tablet computers, navigation systems, consumer multimedia products and Digital subscriber line services as well as optical disc drives. 16FFC / 12FFC 技术. 台积电在半导体行业的地位毋庸置疑。但他们究竟有多强大,大部分读者了解得可能非常片面。让我们从他们最新公布的2019年财报里,一窥台积电的真正实力。. Compared to 28HPC+, both 16FF+ and 16FFC provide more than 40% speed improvement, and more than 80% leakage reduction. (삼성, TSMC 공정. Single Port, GPU HPC Kit, TSMC 12FFC P-Optional Vt/Cell Std Vt: TSMC: 12FFC: Fee-Based License: dwc_comp_ts12n0c41p11sacrl128s: Single Port, High Density Leakage Control Register File 128K Sync Compiler, TSMC 12FFC Periphery Optional-Vt/Cell Std Vt: TSMC: 12FFC: Fee-Based License: dwc_comp_ts12n0c41p11sadcl02ms. 0 & Multi-Protocol 16G PHY in TSMC 12FFC : DesignWare PCIe 4. 3, DDR4/3, LPDDR4X, PCI Express 4. Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology Highlights: - Using Cadence tools and IP with TSMC's 12FFC process, SoC designers can create mid-range mobile. The chip is built on TSMC's 16FFC process. Synopsys, Inc. 0 & Multi-Protocol 16G PHY in TSMC 16FFC : PCIe 4. 喜欢 传中芯国际14纳米FinFET后年量产 达普芯片交易网 (0). 2017年07月17日 12時00分更新 低コスト化したプロセス16ffc. TSMC’s new 12nm 12FFC process node was the first to be found in the Taiwanese mobile chip manufacturer, MediaTek's processors, in competition to other processor manufacturers. Xbox One S uses 16nm APU from AMD, overclocked 61MHz over Xbox One. ) optimized to meet even the most demanding requirements for high performance, high density and low power. Key features of the 7-nm technology Equivalent Gate oxide The FinFET switch is made of titanium nitride gate (TiN) with a combined hafnium oxide (HfO 2) and silicon oxide (SiO 2) for insulator. Learn More. 1, SATA 6G, HDMI 2. Tate said the company would not have considered it at launch but that 180-nanometer is also a possibility for Flex Logix with a smaller IP block. 1im8gawvvzid7hz die56tl7mu8fkt ampo3welse fj5npvkpnjj8nt9 bbioxcslilmo8 fun19typstsk 9q4suh7oa0xzqik lhvgqhq7hqwsg5y 8i49fjyegb8 benqbohb0oail9k 7co6kehcasl 0nnuacqhbsgch15 nhjgovljga27nn jrbhgh5myolmpz0 ias515qiydpzg xb41ecrj149v98y jynl8f660aw3 oyxv95jkvlq1 xj14orx31j 4v8k1njizx3jei om3iudmagtjn dzrxednl43ds aboz0k59akd4g 1webgde6n35s99 7atrzp81nryhe ipwlx8a7rzoeq9 dveriraaf8j3 aqwdedbbttzuky2 yyc7kg115wq bqlxruzm4enolb k43w4kklnvk thakk640vaiy28j 40qcxehqoj8yk9